Desktop 3D Atomic Layer Deposition System ALD

Desktop 3D Atomic Layer Deposition System ALD

Atomic layer deposition (ALD) is a method of depositing substances layer by layer in the form of a single atomic film on the surface of a substrate by chemically adsorbing them onto the deposited substrate through alternating pulses of gas-phase precursors and reacting to form a deposition film. Therefore, it is a true "nano" technology that achieves the deposition of ultra-thin films at the nanoscale in a precisely controlled manner. Due to the saturated chemical adsorption properties utilized by ALD, it can ensure uniform deposition of high shape preservation on large areas, voids, tubular, powder or other complex shaped substrates.
The desktop atomic layer deposition ALD system integrates all the functions required for atomic layer deposition in a compact body (82 x 64 x 31 cm), and can accommodate up to 9 8-inch substrates for simultaneous deposition. The entire series is equipped with a hot wall, combined with the design of precursor bottle heating, pipeline heating, and horizontal nozzle, which ensures temperature uniformity of up to 99.9% and reduces the impact of airflow on temperature to below 0.03%. The design with high temperature stability not only achieves film thickness uniformity better than 99% on an 8-inch substrate, but is also more suitable for uniform deposition of powders, nanofilms, superlattice films, nanoparticles, and complex 3D micro/nano structures. It can also achieve uniform deposition inside micro/nano deep pores with a length to diameter ratio of up to 1500:1.