Desktop 3D Atomic Layer Deposition System ALD
Atomic layer deposition (ALD) is a method of depositing substances layer by layer in the form of a single atomic film on the surface of a substrate by chemically adsorbing them onto the deposited substrate through alternating pulses of gas-phase precursors and reacting to form a deposition film. Therefore, it is a true "nano" technology that achieves the deposition of ultra-thin films at the nanoscale in a precisely controlled manner. Due to the saturated chemical adsorption properties utilized by ALD, it can ensure uniform deposition of high shape preservation on large areas, voids, tubular, powder or other complex shaped substrates.
The desktop atomic layer deposition ALD system integrates all the functions required for atomic layer deposition in a compact body (82 x 64 x 31 cm), and can accommodate up to 9 8-inch substrates for simultaneous deposition. The entire series is equipped with a hot wall, combined with the design of precursor bottle heating, pipeline heating, and horizontal nozzle, which ensures temperature uniformity of up to 99.9% and reduces the impact of airflow on temperature to below 0.03%. The design with high temperature stability not only achieves film thickness uniformity better than 99% on an 8-inch substrate, but is also more suitable for uniform deposition of powders, nanofilms, superlattice films, nanoparticles, and complex 3D micro/nano structures. It can also achieve uniform deposition inside micro/nano deep pores with a length to diameter ratio of up to 1500:1.
ALD application field
Optoelectronic materials
Quantum dot devices
solar cell
OLED display
Nanotechnology
three-dimensional structure
Nanoparticle modification
Micro nano devices
Energy Power
lithium battery
High-energy fuel
Tail gas catalysis
Flexible Electronics
Flexible display
wearable electronics
Electronic skin
Characteristics of ALD system
*Compact in size, can be placed on the experimental desktop for easy integration;
*Hot wall heating for more uniform heating;
*Heating type precursor branch pipe and precursor bottle to prevent sedimentation inside the branch pipe;
*Dual branch pipes, separate transport of oxidation/reduction and organic metal precursors;
*Multiple 8-channel precursor channels, suitable for the deposition of complex/doped thin films;
*Multi layer substrate tray, with multiple simultaneous deposition of 9 substrates;
*Can accommodate multiple 4, 6, and 8-inch samples for simultaneous deposition;
*Can accommodate a substrate with a thickness of 1.25 inches/32mm;
*Standard CF-40 interface.
